Director, Advanced Technology Engagement

• This strategic technology leadership position will have tremendous visibility within the company setting the strategic direction for the semiconductor advanced 2.5D/3D packaging and Advanced 3D-IC segment across Entegris. As part of the office of the CTO, this role will assess long term industry and customer needs encompassing all aspects of advanced packaging. This position will lead these efforts by providing the technical leadership for new product requirements, strategic engagements, and guidance for technical support across Entegris’s global technology portfolio identifying solutions for the most challenging problems facing the advanced semiconductor packaging industry.

• Develops and drives the corporate advanced packaging technology strategy for the company to achieve the highest performance level; as measured by NPR and other key strategic program success metrics
• Determine strategic customer and industry technical needs & communicate the implications to divisional stakeholders
• Create technical engagement plans and initiatives for strategic customers and partners
• Align cross-divisional product development activities with customer expectations and requirements
• Support technical engagements with external research partners
• Communicate advanced packaging technology roadmaps aligned to customer and industry needs and ensures alignment with the relative business divisions
• Partner with sales account managers to conduct regular reviews with customers to understand their future technology needs
• Ensures effective communication between CTO office and divisional R&D teams

Entegris