Yield and quality improvement for HBM products to support product milestone deliverables. Develop and lead integration processes from the conceptual phase to high-volume production for highly complex package development challenges. Work closely with multiple cross functional teams including defect team, probe testing team, and process module team. Able to work independently along with various projects inside of APTD team. Bachelor's degree in physics, chemistry, electrical engineering, mechanical engineering, material science, or other applied engineering discipline. Understanding on technical risk assessment, setup mitigation plan, FMEA, and SPC. Strong focus on advanced package technology (2.5D or 3D package, heterogeneous integration, or fan-out wafer level) research and development. depth in packaging technologies such as BGA, fcCSP, WLCSP, SIP, TSV, and SOC. Hands on experience on flip chip die attach, thermo-compressive bonding, wafer clean, plasma activation. Understanding on statistical process control and development with structured DOE. Understanding on various PFA analysis and method Highly skilled at problem-solving activity and capability of leading cross functional team.
