封裝工程高階主管-國際大廠外派

Adecco

  • East District Hsinchu City
  • Permanent
  • Full-time
  • 17 days ago
  • 外派APAC
  • 封裝工程高階主管
  • New business( 新創事業)
台灣上市櫃國際大廠Responsibilities1.負責NPI(製程開發) 、製程整合、製程良率改善、品質改善 (SPC, FDC, FMEA, QCP, OCAP, SOP 等)2.技術開發&轉移負責人Experience
  • Over 15+ years of experience in semiconductor packaging engineering
  • Extensive knowledge in all levels of semiconductor packaging & assembly
  • Expertise in using the most common design rules on package designs to deliver the IC devices packaged in the lowest cost packages.
  • Senior management role in leading OSAT supplier
  • Communicate clearly and fluently in both Mandarin and English.
#SemiconductorEducationEngineering with a master's degree

Adecco