封裝工程高階主管-國際大廠外派
Adecco
- East District Hsinchu City
- Permanent
- Full-time
- 外派APAC
- 封裝工程高階主管
- New business( 新創事業)
- Over 15+ years of experience in semiconductor packaging engineering
- Extensive knowledge in all levels of semiconductor packaging & assembly
- Expertise in using the most common design rules on package designs to deliver the IC devices packaged in the lowest cost packages.
- Senior management role in leading OSAT supplier
- Communicate clearly and fluently in both Mandarin and English.