Identify, diagnose and resolve assembly process related problems Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step Lead / participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction Support SPC/FDC/RMS/APC Support site to site portability Manage / audit material suppliers to achieve quality, cost and risk management objectives Support internal and external audits Preferred to have over 5-year of working experiences in production line or engineer background Process experienced-on Flip chip bonding(FCB)/ Die bond(DB)/Grinding CIP experienced-on DOE/yield improvement/UPH enhancement Conversation English with TOEIC 650 scores. Master degree or above.
