Own critical taskforce, take ownership of critical initiatives, and leading cross-functional technical team to execute new tech node yield roadmap. Collaborate closely with process integration, technology development, and local yield teams to improve new technology. Support implementation of continuous improvement efforts through Maintenance Optimization Plans: SOPs, Manuals, Equipment Performance, Business Processes, and/or BKMs Make training resources available and provide guidance on process & equipment related programs, systems, and processes Guide and mentor team members, fostering a culture of continuous learning and career development. Foster a forward-thinking mentality, identifying possibilities for improving processes that align with new product requirements while optimizing costs. Define alignment of projects and programs to meet goals for transfer, TTMCY, develop project plans and associated communications material/plan Provide engineering support to internal team members and senior leadership. Work closely with RnD, ADTT teams to improve the Fab processes and equipment to meet company goals. Technical expertise: Detailed knowledge of at least one of the main semiconductor processes, including lithography, dry etch, wet etch, CMP, thin film, diffusion, implantation, and metrology, with at least 10 years of relevant experience in advanced memory or logic node. Strong understanding of process integration Project leadership: Proven skills in leading complex technical projects, ensuring timely delivery of high-quality results. Ability to drive cross-functional technical teams and successfully complete of complex projects. Communication skills: Outstanding written and verbal communication skills. Demonstrated interpersonal skills, including influencing and motivating. Ability to collaborate effectively with multi-functional, multi-cultural teams. Innovation: Track record of providing innovative solutions Education: An advanced degree in Engineering or Science is preferred.
