External Manufacturing NPI Engineer

• Own backend external manufacturing NPI from conceptualization, development, qualification to production launch
• Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
• Collaborate with Central Engineering for new package platform & complex derivative product development to achieve technology & manufacturability readiness
• Drive assembly DFM for new design freeze and new technology development
• Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification build, reliability monitoring and CAB preparation leading to first part release
• Manage manufacturing readiness to achieve smooth production ramp through safe launch. Lead technical support to resolve ramp issues, conduct LVM improvement, set production POR for transition into HVM
• Adoption of data analytics and data-driven approach to problem solving and decision making
• Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
• Participate in quality and process readiness audit to achieve production site readiness
• Co-work with operations to drive continuous yield improvement for evolving challenges
• Subject Matter Expert to address arising package and assembly challenges
• Experienced candidate(s) will be considered for senior role to take on further technology pathfinding and manufacturing roadmap development responsibilities

• Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
• More than 8 years of experience in backend semiconductor IC manufacturing environment, with in-depth process expertise and shop floor experience in one or more key assembly processes
• Hands-on experience in Image Sensor package (iBGA, CSP etc) assembly highly desirable
• Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
• Experience in IC package design/ CAD/ simulation/ characterization will be advantageous
• Good overall understanding of OSAT business landscape and operations
• Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
• Strong project management skills and multi-stakeholder management
• Proficient in statistical analysis methods and familiar with data analytics
• Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous

onsemi