Improve PTS (Probe To Ship) yield to meet BP/LPI targets and rigorously debug PTS detractors. Monitor and improve burn quality through ARH/ABI/ABL, ensuring product grade improvement. Drive RMA handling and CAPA improvement with proven strategies. Improve module HMB1/QMON dpm and product reliability through strict monitoring and engineering interventions. Successfully implement new product qualifications and track Qual/QS sample health. Analyze and handle global MRB cases with outstanding precision. Improve Fab ISPEC/ESPEC equivalency (MSSR) and coordinate wafer outgoing inspections. Bachelor's degree in Engineering or a related field or equivalent experience. Proven experience in quality engineering, preferably within the semiconductor industry. Strong analytical and problem-solving skills. Ability to strictly monitor and control quality metrics. Excellent communication and collaboration abilities. Master's degree in Engineering or related field or equivalent experience. Experience with PTS yield improvement and burn quality monitoring. Knowledge of module HMB1/QMON dpm improvement and new product qualification processes. Demonstrated success in handling RMA and driving CAPA improvements. Familiarity with global MRB case analysis and Fab ISPEC/ESPEC equivalency improvement.
