PTS yield improvement Burn dpm and module dpm improvement DL4 enhancement and shift left to probe for coverage MRB case management and postmortem for CAPA enhancement Product grade yield improvement Wafer level reliability monitoring and shift left to probe for coverage RMA management and analysis for process/probe improvement Problem solving and root cause analysis skills including developing systemic and specific CAPAs for RMA Monitors and drives the quality metrics improvements including, module production fails and RMAs. Monitor Global quality dashboard and report reliability metric not meeting spec and performance Leads the analysis of multiple data sources and ensures appropriate feedback is given to customer Working in collaboration with multiple engineering groups including Process Module Area/RDA/Manufacturing to help identify existing containment action and work towards continuous improvement action BS or higher in Electrical or Electronics Engineering; or Materials Science and Engineering, or Physics. Understanding of electrical device parameters and their relation to the fabrication process. Understanding of statistical methods, data analysis and data mining. Understanding of electrical failure analysis. Understanding of CMOS or silicon based memory devices. Understanding of semiconductor/memory chip reliability mechanisms. Understanding of semiconductor/memory chip process flow. Understanding in semiconductor product disposition and or reliability data collection for unplanned deviations. Understanding in analyzing and determining the root cause of customer returns/return material authorizations (RMA). Understanding of failure mode effect analysis (FMEA) or 8D processes. Understanding of reliability specification like Voltage SPEC, parametric SPEC, and Reliability SPEC
