職缺描述【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4589&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers' products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world's largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Develop, test, and integrate HBM solutions into products. 2. Collaborate with cross-functional teams to ensure successful integration of HBM solutions. 3. Work closely with memory vendors to develop and optimize HBM solutions. 4. Create and maintain technical documentation related to HBM integration and testing. 5. Troubleshoot and resolve issues related to HBM integration and performance. 6. Participate in the development of new products and technologies related to HBM.收合內容工作待遇面議 (經常性薪資達4萬元或以上)查看薪資水平職務類別半導體工程師 、IC封裝／測試工程師工作性質全職工作時間日班休假制度週休二日工作地點新竹縣 寶山鄉 （新竹科學園區）要求條件學歷要求大學以上科系要求工作經驗5 年以上經驗外語能力不拘工作技能不拘附加條件1. Bachelor's degree in Electrical Engineering, Computer Science, or related field. 2. 5+ years of experience in memory design and integration. 3. Strong understanding of HBM technology and its implementation. 4. Experience with memory controller design and testing. 5. Knowledge of circuit design, signal integrity, and power delivery. 6. Excellent problem-solving skills. 7. Strong communication and interpersonal skills.展開全部歡迎身份歡迎所有求職者公司資訊公司名稱品牌名稱產業類別