
Silicon Design Engineer
- Hsinchu City
- Permanent
- Full-time
- Responsible for leading the design, silicon-packaging technology development, and characterization of 3D test chips for business unit applications. This includes identifying new silicon/package pairing paths of record (POR) or alternatives, and driving them through qualification and into volume production.
- The candidate will collaborate with internal functional teams to conduct silicon-packaging interaction risk assessments, and will be accountable for defining evaluation plans, mitigation strategies, and key checkpoints throughout the development cycle.
- Experience: Minimum of 10+ years in process manufacturing with strong problem-solving skills
- Specialized Knowledge: Preferred background in advanced CMOS processes and/or 3D device/advanced packaging technology.
- Educational Qualification: Master's degree required; Doctoral degree preferred.
- Field of Study: Degree in Electrical Engineering, Materials Science and Engineering, or a related field.
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