<外商社群媒體網路服務公司>Silicon Package Development Engineer - AR / VR Products<派遣職>105IW
- Sinyi, Taipei City
- Permanent
- Full-time
- 職務編號: 6348
- 更新日期: 2025-07-24 11:01:23
- Establish relationship with foundry, OSAT, material supplier & support package development activities for multiple research & product programs as process integration engineer
- Support TV design, process feasibility, simulation, design rule/DFM checks with emphasis on thermo-mechanical reliability with vendor
- Review & maintain all aspects of design integration (DI) before TO, sign-off & keep all DI documentation upto date
- Work with XFN teams, foundries/OSAT, substrate suppliers to understand trade-offs & keep track of technology gaps, reliability risk, yield issues & provide regular updates
- Drive DOEs for initial build and product qualification; drive triage effort with partners for any unexpected inline process, equipment & quality issues
- Coordinate FA, monitor area/customer critical charts & drive all aspects of FA & compilation of POR, TOR, FMEA & related KPIs at the vendor
- BS, MS in Materials Science, Chemical, Electrical, Mechanical Engineering or similar field
- 5+ years of experience in package development and process integration
- Knowledge of adv. packaging manufacturing processes e.g. WLCSP, SiP, FO, PoP, TSV, 3D
- Experience with successful package product qualification with complex package design
- Understanding of device reliability and experience with physical failure analysis
- Experience with DOE, data analysis & pkg design software is a plus
- Experience with display and optic related package is a plus
- Experience with TSV process, 2.5D/3D package and Hybrid bonding is a plus
- Excellent problem solving & communication skills
- Ability to work independently and take on projects with minimum supervision