
Technologist, Test Engineering
- Hsinchu City Jhubei, Hsinchu County
- Permanent
- Full-time
- Work with Sandisk internal development team for ASIC product test Development, qualification and characterization on J750, J750EXHD.
- Work with OSAT CMs for new ASIC product introduction, test program deployment and probe card buyoff.
- Test time reduction and Yield improvement of Final Test and Wafer Sort Test.
- Develop new test technologies, new probe card designs and new test methodologies to improve test efficiency and reduce test cost
- Design and debug probe card related issues with OSAT CM and Probe Card Vendors to optimize the test conditions for probe card efficiency and lifespan improvement
- Work with cross functional engineering teams in Line/Qual/RMA related failure analysis and defining corrective actions for test screens
- Work with foundry team for Fab process related yield improvement
- Work with Assembly team and OSAT assembly house for assembly related yield improvement
- Bachelor’s or master’s degree in Electrical Engineering/Computer Engineering with 10+ years of proven experience in Test Engineering role.
- Strong understanding and debug capabilities on probe card from different probe card vendors.
- Excellent communication skills to work with internal cross functional teams and external OSAT CMs, Probe Card vendors, etc.
- Expertise in test strategy development, test plan definition, DFT pattern implementation (ATPG SCAN, TDF, MemBIST and repair, BSCAN, JTAG, and Functional Patterns).
- Familiar with programming skills for writing and debugging ATE test programs and test-related hardware development. Proficiency with J750/EXHD ATE platforms or other logic device ATE testers are preferred.
- Willingness to mentor junior engineers and contribute to the continuous improvement of test engineering processes.
- Knowledge of semiconductor manufacturing process
- Experience with data analysis software in support of characterization reports and yield reporting tools