Installation, accountable and sustain for Debond equipment. Backup for Bond area equipment basic maintenance. Establish and improve process condition and technology. Upgrade tool capability and improve product quality. Establish and modify process management projects. Set up process parameters for a variety of semiconductor equipment. Evaluation, promotion and planning of new equipment / materials. Abnormal analysis and improvement. Preferred to have over 3-year of working experiences in production line. Bachelor degree or above.