MTS Silicon Design Engineer
Advanced Micro Devices
- Hsinchu City
- Permanent
- Full-time
- Perform package extraction for the time domain and frequency domain analysis
- Provide design guidelines for the Package design
- Power integrity analysis for state of art package/system designs, which include but not limited to package layout model extraction, transient noise analysis (ADS, HSPICE) to meet the silicon noise spec, decoupling strategy and analysis.
- SSN(Simultaneous Switching Noise) analysis for I/O (DDR5, LPDDR5, etc.) power domain.
- Eye diagram and jitter analysis for die-package-PCB co-simulations.
- Signal integrity simulation and optimization on package stack-up, power/ ground plane assignment and optimization, decoupling cap locations to minimize power ground noise.
- Opportunity to work on high speed and RF signal trace routing, via optimization,
- length matching and the impact to the timing.
- Crosstalk analysis and reduction on-package considering mutual-effect by on-die, on-silicon interposer and on-PCB.
- Full-wave modeling of vias, connectors, package and PCB channels, components using 3D full-wave EM tools.
- Solid background on transmission-line theory and computational electromagnetics.
- Industry working experiences on signal integrity and power integrity in one or more of signaling standards, PCIe gen4/5, PAM4/8, Ethernet, DDR5, LPDDR5, HBM2/2e/3.
- Experiences with SI tools, HSPICE, HFSS/Q3D, PowerSI/PowerDC, ADS or similar.
- Hands-on lab experiences using high speed real time scope, VNA, TDR, and spectrum analyzer will be a plus.
- Familiar with RF designs, high speed package designs, or high speed PCB designs will be a plus.
- Knowledge and experience of on-die noise model will be a plus
- Master or Ph.D Degree in Electrical Engineering or Computer Science; experience desired