Assembly Process Engineer

NXP Semiconductors

Kaohsiung City
Permanent
Full-time

13 days ago

Be SME & site leader for LTI/NTI/NPI @ OSATs.
Lead assembly process technology assessment/ survey.
Investigate the feasibility of emerging technologies for semiconductor packaging and assembly process offerings.
Participate in patent applications and paper submission.
Oversea travel for problem solving onsite @ OSATs.

Requirements

5+ years experience in Panel Level Package or other Advanced Packages.
10+ years experience in Semiconductor Package. (Pre-Assembly background is preferred.)
Good in English communication (plus if TOEIC score

650). * Experienced in UV/CO2 laser drill, warpage adjustment for fan out packages, wafer treatment (thinning/ dicing/ laser applications), or strip/ wafer/ panel molding process would be a plus.

NXP Semiconductors

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