(Principal) Packaging Engineer

• The Semiconductor Packaging Engineer is a research and development engineer responsible for the design, development, execution, and/or implementation of packaging product, structures, or assembly process technologies.
• -Investigates the feasibility of applying scientific and engineering principles and emerging technologies and capabilities to potential semiconductor packaging and assembly process offerings. Then, effectively develops or designs the implementation of these into manufacturing.
• Maintains substantial knowledge of state-of-the-art principles and theories and may contribute to scientific literature and conferences.
• May also participate in development of patent applications.
• Maintains an understanding of the semiconductor market and effectively translates market requirements to packaging.

• Bachelor or Master degree in Materials Science, Mechanical Engineering, Chemical Engineering or Electrical Engineering, or equivalent.
• At least 5+ years’ experience in WLCSP, flip chip or similar package development with proven track record.
• Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.
• Team player with positive attitude, self-driven, sense of urgency for delivering commitment, and engineering curiosity.
• Fluent in English in both verbal and written communication.

NXP Semiconductors