Forbes前40強-社群美商(新竹)-Silicon Package Development Engineer

• • BS, MS in Materials Science, Chemical, Electrical, Mechanical Engineering or similar field
• • 10+ years of experience in package development and process integration
• • Experience with successful package product qualification with complex package design

• Establish relationship with foundry, OSAT, material supplier & support package development activities for multiple research & product programs as process integration engineer
• Support TV design, process feasibility, simulation, design rule/DFM checks with emphasis on thermo-mechanical reliability with vendor
• Review & maintain all aspects of design integration (DI) before TO, sign-off & keep all DI documentation upto date
• Work with XFN teams, foundries/OSAT, substrate suppliers to understand trade-offs & keep track of technology gaps, reliability risk, yield issues & provide regular updates
• Drive DOEs for initial build and product qualification; drive triage effort with partners for any unexpected inline process, equipment & quality issues
• Coordinate FA, monitor area/customer critical charts & drive all aspects of FA & compilation of POR, TOR, FMEA & related KPIs at the vendor
• Communicate with external partners to evaluate the data
• Working with suppliers to understand their technologies for the pathfinding
• Benchmark the component papers to understand their process
• Work with the manager to align on the next steps.
• Product Package & Board Design (including but not limited to):

• Ball Map Review, Freeze Check, Final Stack up, BOM & Design Review
• Work with PCB vendor on CFM check
• Cross-check database release to substrate supplier
• Check the checklist before builds
• Cross-check substrate supplier is inline with KPI, OQC and stress test
• Periodic monitoring of delivery schedule
• Wafers(including but not limited to):

• FAB OQC, Test & Binning Maps, Thinning, Dicing Specs
• Track wafer count for development, DOE, Qual, System needs
• Review wafer level process flow
• Monitor Different reticle versions
• Periodic monitoring of lot status
• Readiness Collateral(including but not limited to):

• Design collateral, assembly tooling and material readiness
• Assembly TRA DOEs
• Structure analysis
• Line & Test tield
• Manage marking requirements
• Review assembly process flow
• Review build requirements and BOM with execution plan
• Periodic monitoring of lot status and coordinate sample delivery to different sites
• Process Integration(including but not limited to):

• Coordinate first part construction analysis to understand baseline
• Monitor all concerns, addressed with proposed mitigation actions
• Create and maintain process & test issue tracker
• Drive issue resolution and monitor progress

• Knowledge of adv. packaging manufacturing processes e.g. WLCSP, SiP, FO, PoP, TSV, 3D
• Experience with successful package product qualification with complex package design
• Understanding of device reliability and experience with physical failure analysis
• Experience with DOE, data analysis & pkg design software is a plus
• Experience with display and optic related package is a plus
• Experience with TSV process, 2.5D/3D package and Hybrid bonding is a plus
• Excellent problem solving & communication skills
• Ability to work independently and take on projects with minimum supervision

• BS, MS in Materials Science, Chemical, Electrical, Mechanical Engineering or similar field
• 10+ years of experience in package development and process integration

Adecco