Own critical taskforce, take ownership of critical initiatives, leading cross functional technical team to execute new tech node yield roadmap, collaborate closely with process engineering, equipment team, technology development and local yield teams to improve new technology. Guide and mentor team members, fostering a culture of continuous learning and career development. Cultivate an innovative mindset, identifying opportunities for process improvements that align with state-of-the-art product requirement while optimizing costs. Develop a fundamental understanding on structure and device. Understand their impact on manufacturability, cost, and quality. Provide engineering support to internal team members and senior leaders. Technical expertise: Detailed knowledge of semiconductor integration and the interaction of different processes and metrology with at least 10 years of relevant experience in advanced memory or logic node. Good knowledge of process engineering, including lithography, dry etch, wet etch, CMP, thin film, diffusion, and implantation. Project leadership: Proven skills in leading complex technical projects, ensuring timely delivery of high-quality results. Ability to drive cross-functional technical teams and successfully complete of complex projects. Communication skills: Outstanding written and verbal communication skills. Demonstrated interpersonal skills, including influencing and motivating. Ability to collaborate with multi-functional, multi-cultural teams. Innovation: Track record of providing innovative solutions Education: An advanced degree in Engineering or Science is preferred. Although this position requires working in Taiwan, international candidates are welcome to apply.
