
Packaging Engineer
- Hsinchu City
- Permanent
- Full-time
- Drive OSAT to develop advance assembly technology capabilities to meet technology development deliverables.
- Collaborate with integration and design teams to integrate assembly and design needs. Formulate plans to enhance assembly capabilities to meet design needs.
- Establish ecosystem partners to identify assembly capability improvement roadmap
- In depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach etc..
- Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience.
- Well verse in typical technology development tools, FMEA, SPC, control plans, etc..
- Ability to communicate well in both English and Chinese language
- MS degree in Mechanical or Material or Chemical Engineering
- #LI-SC1