Packaging Engineer

Hsinchu City
Permanent
Full-time

2 days ago

Job Description:WHAT YOU DO AT AMD CHANGES EVERYTHINGWe care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.AMD together we advance_SMTS PACKAGING ENGINEERTHE ROLE:Candidate is required to work closely with oSATs and cross-functional teams to bring up and sustain for InFO, EFB/CoWoS-L, CoWoS-S, WLFO and chiplet packages.THE PERSON:The ideal candidate will have a balanced mix of strong technical knowledge as well as program management experience in InFO, EFB/CoWoS-L,CoWoS-S, WLFO and chiplet package functions.The successful candidate must be a team player with a commitment to meeting deadlines. Lead & drive for solutions with an aptitude to thrive in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, with strong interpersonal skills and good communication & presentation skills. He or she must have good command of both written and spoken English.KEY RESPONSIBILITIES:

Responsible for InFO, WFB/CoWoS-L, CoWoS, WLFO and Chiplet package Manufacturing readiness for New Product bring up at manufacturing site.
Responsible for packaging yield, quality, cost and operation productivity improvements and sustaining activities.
Drive process baseline standardization and continuous improvement.
Responsible for the packaging interaction activities among assembly, bump, 3D IC, HBM and wafer fab, wafer sort, Functional Test and Mark/Pack.
Drive Assembly manufacturer to enhance process, equipment & material capability for future generation/technology products
Co-work with Packaging BU on NPI and Ramp Up readiness at manufacturing site. Proactively follow up task assignments and report status timely to stakeholders.
Responsible to manage performance of assembly manufacturing site/supplier regarding yield & quality, out of control lot disposition, and any outliers with close loop on reporting.
The role will require working together with both internal engineering counterparts & extensive interactions within the Package engineering organization, and interacting with several other internal organizations (procurement, supply chain, reliability, etc.) on program deliverables with accurate and timely reporting of program status with executive summary update throughout its life cycle.
Responsible for strategic supplier management.
Plan and execute change management from internal or external parties.
Assist in additional duties as deemed fit by supervisor.
Job may include other duties as assigned/ deemed fit by supervisor.

PREFERRED EXPERIENCE:

Experience in InFO or 2.5D/3D Bump/TSV/Packaging or WLFO process engineering with min total 7 years work experience.
MS degree in Mechanical or Material or Chemical Engineering.
Possess InFO, Chiplet packaging, 2.5D/3D TSV/Packaging, Flip Chip BGA/LGA process knowledge and Chip-Packaging Interaction knowledge.
Deep understanding of quality control, statistics process control and DOE techniques
Lead and manage team experience.
Extensive project management and OSAT management experience
Creative, highly motivated self-driven individual team player with the demonstrated ability to independently complete complex engineering tasks on/ahead of time/Lead & Drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment.
Experience is Preparing reports /Presentation and ability to communicate Root cause and Resolution effectively.
Creative, self-driven, highly motivated individual with demonstrated ability to independently manage complex engineering tasks.
Strong interpersonal communication, analytical, project management, task & time management, and with excellent communication skills.
Experience in managing horizontally across multiple internal functional organization.
Experience in semiconductor engineering environment, with NPI to HVM experience.
Fluent in both spoken and written English.

ACADEMIC CREDENTIALS:

Bachelor/MS degree in Mechanical or Material or Chemical Engineering

LOCATION:Hsinchu, Taiwan

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Benefits offered are described: .AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

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