Ownership of a technical area for materials characterization Provide knowledge of leading edge materials characterization techniques and of new applications and data analysis methodologies. Drive improvement and technical innovation in materials, methods and processes. Have a good theoretical and operating knowledge of all the techniques in your area. Serve as a technical expert within your discipline to team members and managers at site level. Attend external workshops and conferences, give lectures and generate publications. Management of the equipment maintenance by performing diagnostics and interacting with the supplier and the maintenance team. Provide first-line defense for the equipment. Provide recommendations for test structure and test vehicle design for material property evaluation Provide advice and guidance to less experienced team members. Management of the service for the techniques in his/her responsibility. Apply all the procedures and practices concerning safety and housekeeping. At least 5 years experience in semiconductor material related industry Degree/Major: Ph.D in Chemistry, Physic, Material or related field Familiar and well-versed in package and/or materials characterization techniques such as FT-IR/XPS/ToF-SIMS/TMA/ DSC/ TGA/ warpage analysis tool/ CSAM/ ball bond shear and/or pull testing Knowledge of material related failure mechanisms, chip-package interactions, reliability testing, and reliability modeling is preferred Possess hybrid bonding (chip to wafer or wafer to wafer) related material characterization skills and fundamental knowledge. Deep knowledge Advanced Packaging and Memory Integration DRAM, SRAM, NAND (3DIC, FO, Hybrid bond...etc) Excellent data extraction, analysis and reporting and decision skills. (data mining, JMP etc) Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics. Good communication skill to align the perspective through cross functional teams Demonstrated tenacity and ability to work with stringent timelines and manage resources effectively. Ability to work effectively with minimal supervision, and drive recommendations and decisions. Highly motivated and seeking to continue to learn, apply and lead with a growth mindset
