【2026 TSMC RDSS & AO】Product Engineer (PE)

台灣積體電路製造股份有限公司(台積電)

Baoshan, Hsinchu County
$40,000 per month
Permanent
Full-time

1 month ago

職缺描述【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16575&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers' products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world's largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電，成為產品工程師，你將有機會參與世界級先進製程技術，與頂尖團隊合作，挑戰技術極限！你將負責協助產品導入量產、提升良率，並確保產品符合客戶的最高標準。在這裡，你將學習到最先進的半導體技術，並為推動科技發展貢獻力量。我們的專業涵蓋非常廣，從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試，能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝More than Moore〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology.收合內容工作待遇面議 (經常性薪資達4萬元或以上)查看薪資水平職務類別半導體工程師工作性質全職工作時間日班休假制度週休二日工作地點新竹縣寶山鄉（新竹科學園區）要求條件學歷要求碩士博士科系要求工作經驗不拘外語能力
聽｜精通、説｜精通、讀｜精通、寫｜精通工作技能不拘附加條件1. Master's degree or above in Electrical Engineering, Physics, Material and Photonics. 2. Familiar with semiconductor devices / manufacturing, Electronics, and circuit design. 3. Willing to learn new knowledge, good self-learning attitude, enjoy challenge. 4. Good communication skills, be able to work with cross-functional teams & customers. 5. Fluent in English.展開全部歡迎身份歡迎所有求職者公司資訊公司名稱品牌名稱產業類別

半導體製造

聯絡資訊聯絡人員招募處備註【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=16575&source=1111&tags=AO+2026_1111

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