Join our Advance Package Engineering department as a Manager and play a key role in achieving operational excellence, fostering collaboration, and setting new industry standards. Develop a high performing team. Establish team objectives aligned to company strategic objectives and goals. Prioritize objectives, remove barriers, and drive for accountability. Establish job responsibilities, performance goals and development goals for direct reports Determine and successfully implement process / equipment contol strategies to improve productivity and efficiency. Lead and mentor a team of professionals, encouraging a culture of inclusion and collaboration. Define and implement the necessary quality system and documentation, encompassing initial design to full-scale production. Coordinate and execute NPI samples build, and engineering samples build during NPI qualification. Accountable in improving the yield, quality and reliability through proper process definition, characterization and optimization. Manage the selection, installation, and maintenance of equipment necessary for HBM pre-stacking process. Collaborate with vendors and internal teams. Identify risks and mitigation plans with stakeholders & alignment with cross functional teams. Coordinate daily operations and address any challenges to maintain flawless production flow. Bachelor's degree in Engineering or a related field. A minimum of 5 years of experience in process or equipment management role. Prior experience in the memory or semiconductor industry is preferred but not required.
