Own critical taskforce, lead cross-functional technical team for new equipment evaluation or adoption, ensuring timely delivery of solutions. Act as the technical authority when equipment-related issues arise. Provide hands-on support or technical guidance based on the nature of the issue. Guide and mentor team members, fostering a culture of continuous learning and career development. Cultivate an innovative culture, identify opportunities for equipment improvement opportunity that align with state-of-the-art DRAM product requirement while optimizing costs. Develop fundamental understanding of hardware and its role in supporting high-volume manufacturing requirements. Provide engineering support to internal team members and senior leaders. Technical expertise: Demonstrate deep knowledge of semiconductor equipment related to at least one of the following areas: lithography, dry etch, wet etch, CMP, thin film, diffusion, implantation, and metrology. You should have at least 10 years of relevant experience in advanced node. Additionally, a strong understanding of related process engineering is essential. Project leadership: Proven ability to lead complex technical projects, ensuring a timely delivery of high-quality results. Proven skills in driving cross-functional technical teams and completing of complex projects. Communication skills: Exhibit outstanding written and verbal communication abilities. Demonstrated interpersonal skills, including influencing and motivating. Ability to collaborate with multi-functional, multi-cultural teams. Innovation: Track record of providing innovative solutions Education: An advanced degree in Engineering or Science is preferred. Although this position requires working in Taiwan, international candidates are welcome to apply.
