Work closely with the Advanced Packaging Technology Development (APTD) team to support defining product roadmaps and execution strategies aligned with integrating/packaging technology trends. Provide Business Unit (BU) support and direction to local Operations teams during NPI phases of new HBM products, streamlining business enablement and execution. Minimum 6 years of experience in semiconductor packaging Experience in 2.5D System in Package (SIP) manufacturing industry Experience in DRAM manufacturing preferred Master's degree in engineering (Chemical, Material, Mechanical or Electrical Engineering) Minimum 4 years of experience in customer technical support/engagement roles Experience in business role preferable - product management, product planning, technical marketing. Fluent in Mandarin with good, clear communication skills in English Independent thinking, with strong sense of responsibility and proactive approach to ensure high standard of work is delivered on time
